Section 8470

21.00 or 8470.29.00

85 8473.29.00 - - Other

86 8473.30.10 - - Assembled printed circuit boards

87 8473.30.90 - - Other

88 8473.40.00 - Parts and accessories of the machines of heading 84.72

89 8473.50.10 - - Suitable for use with the machines of heading 84.71

90 8473.50.90 - - Other

91 8477.80.31 - - - Lamination presses for the manufacture of printed circuit boards or printed wiring boards

92 8477.90.32 - - - Parts of lamination presses for the manufacture of printed circuit boards or printed wiring boards

93 8479.83.00 - - Cold isostatic presses

94 8479.89.10 - - - Automated machines for the placement or the removal of components or contact elements of a kind used solely or principally for the manufacture of printed circuit assemblies

95 8479.89.50 - - - Machinery for assembling central processing unit (CPU) daughter boards in plastic cases or housings; apparatus for the regeneration of chemical solutions used in the manufacture of printed circuit boards or printed wiring boards; equipment for mechanically cleaning the surfaces of printed circuit boards or printed wiring boards during manufacturing; registration equipment for the alignment of printed circuit boards or printed wiring boards or printed circuit assemblies in the manufacturing process

96 8479.89.61 - - - - Automatic service-vending machines

97 8479.89.69 - - - - Other

P.U. (A) 91 645

Description 98 8479.90.10 - - Of goods of subheading 8479.89.10

99 8479.90.50 - - Of goods of subheading 8479.89.50

100 8485.30.90 - - Other

101 8485.80.00 - Other

102 8485.90.90 - - Other

103 8486.10.10 - - Apparatus for rapid heating of semiconductor wafers

104 8486.10.20 - - Spin dryers for semiconductor wafer processing

105 8486.10.30 - - Machines for working any material by removal of material, by laser or other light or photon beam in the production of semiconductor wafers

106 8486.10.40 - - Machines and apparatus for sawing monocrystal semiconductor boules into slices, or wafers into chips

107 8486.10.50 - - Grinding, polishing and lapping machines for processing of semiconductor wafers

108 8486.10.60 - - Apparatus for growing or pulling monocrystal semiconductor boules

109 8486.10.90 - - Other

110 8486.20.11 - - - Chemical vapour deposition apparatus for semiconductor production

111 8486.20.12 - - - Epitaxial deposition machines for semiconductor wafers; spinners for coating photographic emulsions on semiconductor wafers

112 8486.20.13 - - - Apparatus for physical deposition by sputtering on semiconductor wafers;

physical deposition apparatus for semiconductor production

113 8486.20.21 - - - Ion implanters for doping semiconductor materials

114 8486.20.31 - - - Deflash machines for cleaning and removing contaminants from the metal leads of semiconductor packages prior to the electroplating process; spraying appliances for etching, stripping or cleaning semiconductor wafers

115 8486.20.32 - - - Equipment for dry etching patterns on semiconductor materials

P.U. (A) 91 646

Description 116 8486.20.33 - - - Apparatus for wet etching, developing, stripping or cleaning semiconductor wafers

117 8486.20.39 - - - Other

118 8486.20.41 - - - Direct write-on-wafer apparatus

119 8486.20.42 - - - Step and repeat aligners

120 8486.20.49 - - - Other

121 8486.20.51 - - - Dicing machines for scribing or scoring semiconductor wafers

122 8486.20.59 - - - Other

123 8486.20.91 - - - Lasercutters for cutting contacting tracks in semiconductor production by laser beam

124 8486.20.92 - - - Machines for bending, folding and straightening semiconductor leads

125 8486.20.93 - - - Resistance heated furnaces and ovens for the manufacture of semiconductor devices on semiconductor wafers

126 8486.20.94 - - - Inductance or dielectric furnaces and ovens for the manufacture of semiconductor devices on semiconductor wafers

127 8486.20.95 - - - Automated machines for the placement or the removal of components or contact elements on semiconductor materials

128 8486.20.99 - - - Other

129 8486.30.10 - - Apparatus for dry etching patterns on flat panel display substrates

130 8486.30.20 - - Apparatus for wet etching, developing, stripping or cleaning flat panel displays

131 8486.30.30 - - Chemical vapour deposition apparatus for flat panel display production; spinners for coating photosensitive emulsions on flat panel display substrates; apparatus for physical deposition on flat panel display substrates

132 8486.40.10 - - Focused ion beam milling machines to produce or repair masks and reticles for patterns on semiconductor devices

P.U. (A) 91 647

Description 133 8486.40.20 - - Die attach apparatus, tape automated bonders, wire bonders and encapsulation equipment for the assembly of semiconductors;

automated machines for transport, handling and storage of semiconductor wafers, wafer cassettes, wafer boxes and other materials for semiconductor devices

134 8486.40.30 - - Moulds for manufacture of semiconductor devices

135 8486.40.40 - - Optical stereoscopic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles

136 8486.40.50 - - Photomicrographic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles

137 8486.40.60 - - Electron beam microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles

138 8486.40.70 - - Pattern generating apparatus of a kind used for producing masks or reticles from photoresist coated substrates

139 8486.90.11 - - - Of apparatus for rapid heating of semiconductor wafers

140 8486.90.13 - - - Of machines for working any material by removal of material, by laser or other light or photon beam in the production of semiconductor wafers

141 8486.90.14 - - - - Tool holders and self-opening dieheads; work holders; dividing heads and other special attachments for machine-tools

142 8486.90.15 - - - - Other

143 8486.90.16 - - - Of grinding, polishing and lapping machines for processing of semiconductor wafers

144 8486.90.17 - - - Of apparatus for growing or pulling monocrystal semiconductor boules

145 8486.90.21 - - - Of chemical vapour deposition apparatus for semiconductor production

146 8486.90.23 - - - Of ion implanters for doping semiconductor materials; of apparatus for physical deposition by sputtering on semiconductor wafers; of physical deposition apparatus for semiconductor production; of direct write-on-wafer apparatus, step and repeat aligners and other lithography equipment

P.U. (A) 91 648

Description 147 8486.90.24 - - - - Tool holders and self-opening dieheads; work holders; dividing heads and other special attachments for machine-tools

148 8486.90.25 - - - - Other

149 8486.90.26 - - - - Tool holders and self-opening dieheads; workholders; dividing heads and other special attachments for machine-tools

150 8486.90.27 - - - - Other

151 8486.90.28 - - - Of resistance heated furnaces and ovens for the manufacture of semiconductor devices on semiconductor wafers; of inductance or dielectric furnaces and ovens for the manufacture of semiconductor devices on semiconductor wafers

152 8486.90.29 - - - Other

153 8486.90.31 - - - Of apparatus for dry etching patterns on flat panel display substrates

154 8486.90.32 - - - - Tool holders and self-opening dieheads; work holders; dividing heads and other special attachments for machine-tools

155 8486.90.33 - - - - Other

156 8486.90.34 - - - Of chemical vapour deposition apparatus for flat panel display production

157 8486.90.36 - - - Of apparatus for physical deposition on flat panel display substrates

158 8486.90.41 - - - Of focused ion beam milling machines to produce or repair masks and reticles for patterns on semiconductor devices

159 8486.90.42 - - - Of die attach apparatus, tape automated bonders, wire bonders and of encapsulation equipment for assembly of semiconductors

160 8486.90.43 - - - Of automated machines for the transport, handling and storage of semiconductor wafers, wafer cassettes, wafer boxes and other materials for semiconductor devices

161 8486.90.44 - - - Of optical stereoscopic and photomicrographic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles

162 8486.90.45 - - - Of electron beam microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles

P.U. (A) 91 649

Description 163 8486.90.46 - - - Of pattern generating apparatus of a kind used for producing masks or reticles from photoresist coated substrates, including printed circuit assemblies

164 8504.40.11 - - - Uninterruptible power supplies (UPS)

165 8504.40.19 - - - Other

166 8504.50.10 - - Inductors for power supplies for automatic data processing machines and units thereof, and for telecommunications apparatus

167 8504.50.20 - - Chip type fixed inductors

168 8504.90.20 - - Printed circuit assemblies for the goods of subheading 8504.40.11,